The diffusion furnace is one of the important process equipment in the front-end of semiconductor production lines, used for processes such as diffusion, oxidation, annealing, alloying, and sintering in industries like large-scale integrated circuits, discrete devices, power electronics, optoelectronic devices, and optical fibers. The maximum operating temperature of the product can reach 1350°C. The furnace body is designed with a low heat capacity and includes vertical or horizontal heating elements. Heaters can be customized based on specific processing needs.
| Product Name | Port | Furnace body |
| Classification temperature (°C) | 1500 | 1500 |
| Working temperature (°C) | 1350 | 1350 |
| Bulk density (Kg/m³) | 450 | 350 |
| 24-hour thermal insulation permanent line shrinkage(%) | -1.5 1400℃ | -1.5 1400℃ |
| Thermal conductivityW/(m·k) | ||
| 400℃ | 0.08 | 0.08 |
| 600℃ | 0.12 | 0.12 |
| 800℃ | 0.14 | 0.14 |
| 1000℃ | 0.22 | 0.22 |
| Chemical composition(%) | ||
| Al₂O₃+SiO₂ | 98 | 98 |
| Fe₂O₃ | <0.5 | <0.5 |
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